Last Updated on 12 months by admin
Samsung is possibly considering the construction of a new semiconductor manufacturing facility in Japan. The facility would include Samsung’s first test line for chip packaging in the country. According to a new report, if Korean tech giant “Samsung” proceed with the construction Japanese government is ready to offer subsidies worth around 110 million US dollars (15 billion yen).
In contrast to the report published earlier, the construction of the semiconductor plant in Japan is not yet finalized by Samsung. Furthermore, Reuters reports that the establishment of the Samsung facility would cost approximately 40 billion yen, which is equivalent to approximately 292 million US dollars at the current exchange rate.
The Japanese government is willing to cover about one-third of Samsung’s costs.
The final decision is in the hands of “Samsung”. If they move forward with the construction of the semiconductor (chip) factory, the government of Japan is willing to cover more than one-third of the costs. To be more specific the Japanese government is willing to offer 15 billion JPY (110 million USD) for the Korian Tech giant. However, Samsung states that nothing is so far decided, and it remains to be seen whether the company will utilize these subsidies.
Currently Samsung’s research and development center is established in Yokohama which is also displayed in this post’s main image. If the plan of constructing the Samsung semiconductor factory becomes a reality it will be located next to the R&D facility. Furthermore, building the facility could benefit Samsung by having closer relationships with local chip material suppliers and equipment manufacturers.
